Xinjin Micro Semiconductor (Shenzhen) Co., Ltd. is headquartered in Shenzhen and focuses on defining SiP microsystem chip products, designing SiP circuits, designing SiP packaging structures, and developing packaging and testing processes by combining silicon and non silicon circuits in high-power applications. It has developed into a power SiP microsystem chip product company with a SiP chip design and production platform.

The company‘s R&D layout is located in Shenzhen and Dongguan, and it has an excellent R&D team both domestically and internationally. It also collaborates with universities to further expand its technological development direction.

The company cooperates with the Shenzhen Research Institute of Huazhong University of Science and Technology in Songshan Lake, Dongguan, and has established a joint laboratory for SiP microsystem chip design and advanced packaging, providing a platform for SiP microsystem chip design, verification, and pilot testing production lines. Based on the Songshan Lake Laboratory platform, we can provide joint design and pilot testing platform services for internal or third-party users. At the same time, on the basis of laboratory project cooperation, the Shenzhen Dongguan company can further promote and support the commercialization and development of third-party companies, institutions, or individuals in conceptual design products through the "joint design, brand sharing, platform production, shared sales channels, and profit sharing" platform services of the "National Chuangxin" platform, in order to help support the development of the SiP industry direction.

Company vision: To become a leader in the field of SIP power system chips.

Company mission: Continuously innovating technology to provide value to customers.

Business philosophy: Focus on professionalism.